الفهرس 
chapter 1Only 14 pages are availabe for public view
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Abstract
The detailed micro electronic and mechanical systems (MEMS) for a mobile microprocessor complex shape were modeled using the Finite Element processing (FEP). A close fatigue and impact analyses were performed on the Ball Grid Array (BGA) Integrated Circuit (IC) using Abaqus\CAE finite element analysis software.
The main objective of this research is to make sure that BGA products can endure the roughness of the daily usage, where a portable electronic product is habitually coupled with potential damage of functional failure when the device falls.