الفهرس 
IntroductionOnly 14 pages are availabe for public view
 |  | from | 138 |  |  |
| | | from | 138 | | |
Abstract
Experinental study on the thermal performance of electrical enclosures is performed.
The accumulation of heat in a sealed electrical enclosure is potentially damaging the electronic devices.
Overheating can shorten the life expectancy of costly electrical components or lead to failur of the system .
The present work pleads with to the thermal control by natural convection and forced convection cooling of the electric components assembly in confined spaces.
The study to be presented includes four cases of enclosures as follow a Non- Vented, Vented natural, Vented forced and Inversed Vented natural enclosures. The cases study includes four cases as following: case A: is a non-vented model by natural convection, case B: is a versed vented vertical enclisure by natural convection.
The enclosure has dimensions of 1300 mm heigt, 800 mm width and 300mm depth.
The vented enclosure has three vents, tow are in the upper vertical enclosure area where the third vent at the bottom. The electrical components are placed in the center of the enclosure.
Generally, the most of heat is liberated from the electrical components in the upper portion of the encllosure, so a forth triad was made by inverting the enclosure for the non-vented case .The experimental results show that the forced convection case is the best one for the three cases, wher the maximum temerature attached was 84c.But inverting the vented enclosure 90.with the floor get the maximum temperature changed from 98 c to 55 c, so this Is the forth case .And so the fourth case is the best one of the four cases.
A comparison between enclosures of different cases is considered in the ventilation analysis , Experimental study to determine the thermal bebavior in an enclosure is performed for a vertical position under steady state operation. The study prove that a control of temperature rise inside enclosure vary with the positions of the components within an enclosure to allows air to move from the bottom to the top and then to outside enclosure. A CFD program is used in this study to predict validation for all previous cases used the 3D model of geometry by FLUENT (ANSIS 14 ) , the CFD program is used to simulate the heat tranfer and the flow characteristics around electric components inside the enclosures.