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العنوان
Effect of Ni and Sb Additions on the Thermal and Mechanical Properties of Sn-Ag-Cu(SAC105)Lead-Free Solder Alloy /
المؤلف
Abd El-Azeez, Doaa Abd El-hamed Mohameed.
هيئة الاعداد
باحث / دعاء عبدالحميد محمد نصرالله
مشرف / ا.د/عبدالرحمن عبداللة الدالى
مشرف / ا.د/ عادل فوزى إبراهيم
مشرف / د. / أحمد السيد حماد
مناقش / ا.د/عبدالرحمن عبداللة الدالى
الموضوع
Thermal batteries - Materials. Thermal physics.
تاريخ النشر
2013.
عدد الصفحات
p 135. :
اللغة
الإنجليزية
الدرجة
ماجستير
التخصص
فيزياء المادة المكثفة
تاريخ الإجازة
1/1/2013
مكان الإجازة
جامعة الزقازيق - كلية العلوم - الفيزياء
الفهرس
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Abstract

Sn-Pb solder alloy for metal interconnections has a long history, dating back 2000 years. These alloys are the dominant solders used widely in manufacture because of their unique combination of material properties, such as low cost, availability, low melting temperatures, ductility and excellent wetting on Cu and its alloys. It is well known that conventional Pb- containing solders are harmful to both people’s health and environment, so the exploration of lead-free solders as substitute of lead-tin alloys is paid more attention, especially with the arrival of legislative restriction on the use of lead solders by European Union to pass legislation prohibiting or restricting the use of Pb–Sn solders