الفهرس 
DESIGN OF THE PROPOSED INSPECTION SYSTEMOnly 14 pages are availabe for public view
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Abstract
This study is paying special attention to Printed Circuit Boards (PCBs) manufacturing as one of the
most important applications for Automatic Visual Inspection (AVI). It provides fast modified
procedure to detect the components and the solder-joints of PCBs. In the Automatic Optical
Inspection (AOI), one of the AVI approaches, the principal challenges in PCB analysis lie in the
high reflectance of the surface, the un-even illumination, the specular nature of the solder
joints, and the potential complexity of the background.
For industrial application, the feasibility and reliability form two major factors to keep the
marketing competition. In case of the PCB, the minimization and the advancing in the PCB
manufacturing multiplies the time-consuming for inspection.
The suggested methodology employs the Discrete Cosine Transform (DCT) to enhance the desired
feature cohesion. Furthermore, the color disturbance is involved to illustrate the components.
Finally, the detection has been done by employing a multi-stage segmentation. The classifier is
designed to detect five different classes depicts the soldering conditions: good, missing,
no-solder, exceed and bridged. The features of four different classes are extracted using a
time-frequency localization wavelet.
The experiment expresses good results supported by the near optimality of the Log-Gabor filter
bank. This allows the image to convolve with a Gabor atoms in the logarithmic prospective, whereas
a zero DC component. The obtained results were undergone upon a fast time implemented algorithm in
order to meet the flexibility conditions.