الفهرس 
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Abstract
Enhancing corrosion resistance of copper is often associated with the presence of cuprous oxide (Cu2O) films on the substrate. The electrodeposition method is considered low cost-effective due to its simple operation, high production rate and capability to handle complex geometry.
The present work describes electrodeposition process of pure copper using 10%wt.H2SO4 as an electrolyte solution and the voltage was 5 V for different times, was conducted on the copper surface with electrochemical cell.
The surface adhesion can be enhanced by some additives such as Gelatin or Dimethoxymethane.in some causes using calcination (heating at 250 ˚C for 30 min) shows a hydrophobic/ super hydrophobic film CuO/Cu2O with a high contact angle of about was obtained after 10 min electrochemically deposition process.
Good adhesion property and the lowest corrosion rate were observed at 10% wt. H2SO4 with 10 ppm Gelatin followed by calcination. The results showed that a super hydrophobic film (Cu2O) with a high contact angle of about 162° and the lowest corrosion rate was 0.7 mpy, obtained after electrodeposited 10 min. By using Eva Topaz software and results of XRD analysis showed that the crystalline size of Cu2O was about 80 nm.