الفهرس 
IntroductionOnly 14 pages are availabe for public view
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Abstract
In recent years, due to the rapid development within the electronic industry, the thermal management of electronic components becomes an important and serious issue. Since the generated heat flux from the modern electronic components is very high, liquid cooling becomes important due to limitation of natural and forced air-cooling. Liquid cooling can be employed with or without boiling. However, liquid cooling with boiling reduces effectively, the temperature of electronic components compared to single-phase liquid cooling. Thermosyphon cooling is an alternative cooling technology of dissipating high local heat flux. A reboiler thermosyphon consists of an evaporator where heat is dissipated from the electronic component and a condenser where heat is rejected to the ambient. These two components are connected by a riser and a downcomer.The purpose of present study is to investigate, theoretically and experimentally, the heat transfer of a reboiler thermosyphon. In theoretical model, the flow is described by continuity, momentum and energy equations. The flow is assumed laminar, steady and two dimensional with constant properties. The differential forms of governing equations are, numerically, solved using finite difference technique. The effect of three parameters: input heat (0.88 W ≤ ≤ 40 W), the working fluid filling ratio (volume of working fluid to the evaporator volume (32% ≤ F.R. ≤ 96%)) and natural or forced air cooling for the condenser are experimentally investigated. It is observed, that heat transfer coefficient and Nusselt number are decreased along condensation surface and average heat transfer coefficient and Nusselt number are increased with increasing heat flux. The maximum overall heat transfer coefficient and , in turn, Nusselt number are achieved at about 0.5 filling ratio for the natural convection and forced convection.