الفهرس 
SummeryOnly 14 pages are availabe for public view
 |  | from | 106 |  |  |
| | | from | 106 | | |
Abstract
Cooling of electronic equipment’s is playing an important role in the last decades as a world experiences a technological boom in all fields. With the continued development in the speed of microprocessors, heat is generated and must be removed efficiently so that performance is not affected. During the present study, the impact of using nanofluids for cooling a microprocessor was carried out experimentally and numerically. The experiments were conducted to validate the CFD model. The CFD model was applied for examining the impact of nanofluid concentration, and coolant flow rate on the thermal-hydraulic characteristics of the microprocessor. CuO-water nanofluid was used with six different nanoparticle volume fractions of 0.5, 0.86, 1.5, 2.25, 3.5 and 5 vol. %. The developed CFD model was validated with the obtained experimental results and with results of other researchers, which showed good agreement. The results showed that for the investigated electronic microprocessor with an area of 5 cm by 5 cm and dissipated power of 130 W, an enhancement of 8.1 % in thermal conductance was noticed when using CuO-water nanofluid as compared to water for the studied operating range. The overall thermal hydraulic performance of using CuO-water nanofluid is found to accomplish higher value of 1.47 at nanoparticle volume fraction of 5% of CuO and Reynolds number of 800.